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FEM analysis of multifluid heat exchangers
(Emerald Group Publishing Limited, 2004)
Heat exchangers are devices for exchanging energy between two or more fluids. They find applications in various industries like power, process, electronics, refining, cryogenics, chemicals, metals and manufacturing sector. ...
Thermal investigations of microelectronic chip with non-uniform power distribution: temperature prediction and thermal placement design optimization
(Emerald Group Publishing Limited, 2004)
This paper presents the thermal analyses carried out to predict the temperature distribution of the silicon chip with non-uniform power dissipation patterns and to determine the optimal locations of power generating sources ...
Prediction of temperature in silicon chip with non-uniform power: a Lagrangian interpolation approach
(Emerald Group Publishing Limited, 2004)
This paper describes a generalized method of predicting the temperature distribution of the silicon chip with non-uniform power dissipation patterns using Lagrangian interpolation function. A simplified heat sink thermal ...
Flow analysis for flip chip underfilling process using characteristic based split method
(IEEE Conference Publications, 2004)
In this paper, an effort has made to analyze and numerically simulate the fluid flow in chip cavity using characteristic based split (CBS) method. Simulation methodology includes a solver for the fluid flow equations coupled ...