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A study for optimum productivity yield in 0.16μm mixed of wafer fabrication facility
(Institute of Electrical and Electronics Engineers (IEEE), 2010-06-28)
This research is to study the opportunity to achieve optimum productivity yield in 0.16μm product mixed through understanding the impact of loading utilization towards the capacity. The study is important to model the ...
Dicing die attach film for 3D stacked die QFN packages
(IEEE Conference Publications, 2012)
The application of die attach film (DAF) in semiconductor packaging is become wider especially in three dimensional (3D) QFN stacked die package. As wafer getting thinner until beyond 100 μm, challenges in die attach process ...