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Now showing items 11-20 of 25
Temperature cycling analysis for ball grid array package using finite element analysis
(Emerald Group Publishing Limited, 2011)
Purpose - The purpose of this paper is to discuss the capability of finite element analysis (FEA) in performing the virtual thermal cycling reliability test to evaluate the reliability of solder joints in a ball grid array ...
Thermal investigations of microelectronic chip with non-uniform power distribution: temperature prediction and thermal placement design optimization
(Emerald Group Publishing Limited, 2004)
This paper presents the thermal analyses carried out to predict the temperature distribution of the silicon chip with non-uniform power dissipation patterns and to determine the optimal locations of power generating sources ...
Performance of wire-on-tube heat exchangers used in immersion cooling for electronic packages
(IEEE Conference Publications, 2000)
In this investigation, closed loop immersion cooling of an electronic package with external condenser-a wire-on-tube heat exchanger being attached to its enclosure-is analysed. The dielectric vapour leaving the enclosure ...
Prediction of temperature in silicon chip with non-uniform power: a Lagrangian interpolation approach
(Emerald Group Publishing Limited, 2004)
This paper describes a generalized method of predicting the temperature distribution of the silicon chip with non-uniform power dissipation patterns using Lagrangian interpolation function. A simplified heat sink thermal ...
Modeling of wire-on-tube heat exchangers using finite element method
(Elsevier Ltd., 2002)
Wire-on-tube heat exchangers are analysed under normal operating conditions (free convection) using finite element method. Galerkin's weighted residual method is used to minimise the errors. The effects of ambient temperatures ...
Test chip and substrate design for flip chip microelectronic package thermal measurements
(Emerald Group Publishing Limited, 2006)
Purpose: This paper's purpose is to review the design of a flip chip thermal test vehicle. Design/methodology/approach: Design requirements for different applications such as thermal characterization, assembly process ...
Thermal management of multi-chip module and printed circuit board using FEM and genetic algorithms
(Emerald Group Publishing Limited, 2005)
Purpose - To determine the optimal chip/component placement for multi-chip module (MCM) and printed circuit board (PCB) under thermal constraint. Design/methodology/approach - The placement of power dissipating chips/component ...
Fast transient solutions for heat transfer [FEM]
(IEEE Conference Publications, 2003)
The implementation of the finite element method (FEM) in thermal analysis usually produces a formulation in the space/time domain. This kind of space/time domain formulation leads to a set of ordinary differential equations ...
Optimization of PCB component placement using genetic algorithm
(World Scientific Publishing, 2002)
This paper focuses on optimization problems faced in automated assembly of Printed Circuit Board (PCB). In order to optimize the throughput rate of these automated machines, the time taken for the pick and place operation ...
Numerical simulation of underfill encapsulation process based on characteritsic split method
(John Wiley & Sons, Inc., 2006)
Electronic packaging protects the integrated circuit chip from environmental and mechanical damages. Underfilling encapsulation is an electronic packaging technology used to reinforce the solder joints between chip and the ...