Browsing Researchers by Subject "Thermal management"

Now showing items 1-5 of 5

    • Development of nano-material (nano-silver) in electronic components application 

      Mazlan, Mohamed; Anizah, Kalam, Dr.; Nik Rosli, Abdullah, Dr.; Loo, Huck Soo, Prof. Madya Ir. Dr.; Mohd Mustafa Al Bakri, Abdullah; M. S., Abdul Aziz; Khor, C. Y.; Mohammad Amizi, Ayob; Mohd Sukhairi, Mat Rasat (AENSI Publisher All rights reserved, 2013-10)
      This paper presents the development of nano-material in electronic components especially in Plastic Leaded Chip Carrier (PLCC) application. The effect of nano-material in Plastic Leaded Chip Carrier (PLCC)will improve ...

    • The effect of gap between plastic leaded chip carrier (PLCC) using computational fluid dynamic (CFD) software, FLUENT™ 

      Mazlan, Mohamed; Anizah, Kalam, Dr.; Nik Rosli, Abdullah, Dr.; Loo, Huck Soo, Prof. Madya Ir. Dr.; Mohd Mustafa Al Bakri, Abdullah; M. S., Abdul Aziz; Khor, C. Y.; Mohammad Amizi, Ayob; Mohd Sukhairi, Mat Rasat (AENSI Publisher All rights reserved, 2013-10)
      This paper presents the effect of gap between Plastic Leaded Chip Carrier (PLCC) by using three dimensional numerical analysis of heat and fluid flow in computer. 3D model of microprocessors is built using GAMBIT and ...

    • Evaluation on metal matrix composite of CuSiC as candidate for thermal management materials in electronics packaging 

      Mohabattul Zaman, S NS Bukhari, Prof. Madya Ir.; Brabazon D.; M.S.J. Hashmi (Universiti Malaysia Perlis (UniMAP), 2012-06-18)
      In the quest to pack into ever shrinking cell phone, digital audio players or personal digital assistance (PDA), which will definitely helps to ensure the electronic equipment does not overheat, fail or malfunction, ...

    • Thermal management of multichipmodule (MCM) using genetic algorithms 

      Jeevan, Kanesan; Seetharamu, Kankanhally N.; Ishak, I.A.; Ghulam, Abdul Quadir, Prof. Dr. (IEEE Conference Publications, 2003)
      The placement of power dissipating chips for a multichip module (MCM) is carried out using genetic algorithms. Since high power is to be dissipated over a small area of a module, the heat must be conducted away efficiently. ...

    • Three dimensional simulation of thermal pad using nanomaterial, nano-silver in semiconductor and electronic component application 

      Mazlan, Mohamed; Rahim, Atan, Prof. Madya Dr.; Mohd Mustafa Al Bakri, Abdullah; Muhammad Iqbal, Ahmad; Mohd Huzaifah, Yusoff; Fathinul Najib, Ahmad Saad (Trans Tech Publications, 2013)
      Thermal pad is new technology in this world that been used in PLCC in order to reduce junction temperature to the minimum level in electronic components. In electronic industry, the electronic components that exceed 70°C ...