Browsing Researchers by Subject "Junction temperature"

Now showing items 1-9 of 9

    • CuDia slug size variation analysis on heat dissipation of high power LED 

      Vairavan, Rajendaran; Retnasamy, Vithyacharan; Zaliman, Sauli, Dr. (Trans Tech Publications, 2014-01)
      The current advancement of LED has prompt thermal challenges from the packaging point of view. The reliability of the LED is significantly influenced by each of its packaging component. This paper presents the investigation ...

    • Cylindrical shape slug heat conduction numerical analysis using copper material 

      Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr.; Vairavan, Rajendaran (AENSI Publications, 2013-10)
      High power light emitting diodes have the edge over the conventional lighting system in terms of efficiency, low energy consumption and long operational lifetime. Nevertheless, the heat dissipation issue of the high power ...

    • Effects of heat slug shapes on the heat dissipation of high power LED 

      Zaliman, Sauli, Dr.; Vairavan, Rajendaran;; Retnasamy, Vithyacharan (Trans Tech Publications Inc., 2014-02)
      High power light emitting diodes are currently challenged by thermal issue of high heat generation which limits the reliability and efficiency. Each component in the LED package has a significant role in heat dissipation. ...

    • Heat dissipation analysis under natural convection condition on high power LED 

      Vairavan, Rajendaran; Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr. (AENSI Publisher All rights reserved, 2013-10)
      As the technology downscales with superior power and increased package density, the thermal effects of the high power LED are significant. Thus, the operating junction temperature of the high power light emitting diodes ...

    • Heat sink fin number variation analysis on single chip high power LED 

      Zaliman, Sauli, Dr.; Vairavan, Rajendaran; Retnasamy, Vithyacharan (Trans Tech Publications, 2014-01)
      Thermal management of high power LED is crucial the reliability and performance of the LED affected by the heat produced during photon emission. Heat sinks are utilized to dissipate the heat and to lower the operating ...

    • High power LED heat dissipation analysis via copper diamond slug 

      Vairavan, Rajendaran; Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr. (AENSI Publisher All rights reserved, 2013-10)
      The emergence of high power light emitting diode as a novel electronic based light source is due to its vast advantage in terms of optical efficacy, low power consumption and enhanced life time. However, the performances ...

    • LED heat dissipation analysis using composite based cylindrical slug 

      Zaliman, Sauli, Dr.; Vairavan, Rajendaran; Retnasamy, Vithyacharan (Trans Tech Publications Inc., 2014-02)
      The optical efficacy and reliability of light emitting diode is extensively influenced by the operating junction temperature of the LED. Therefore, the evaluation of junction temperature is significant. This paper reports ...

    • LED heat dissipation study using different Cu slug size 

      Vairavan, Rajendaran; Retnasamy, Vithyacharan; Zaliman, Sauli, Dr.; Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr. (AENSI Publisher All rights reserved, 2013-10)
      High power light emitting diodes (LEDs) have significant contribution in illumination industry due exceptional advantages in terms of low power consumption, superior reliability, prolonged life time and high efficiency. ...

    • Operating temperature analysis of LED with cylindrical Cu slug 

      Vairavan, Rajendaran; Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan (Trans Tech Publications, 2014-01)
      High power light emitting diodes is the new era of lighting due to momentous supremacy in terms of lighting efficacy over traditional lighting systems. The reliability of LED is dependent on its junction temperature. This ...