Now showing items 1-1 of 1

    • Optimization of liquid cooling fins in microelectronic packaging 

      Ng, N. T.; Lai, K. W.; Ghulam, Quadir, Prof. Dr.; Seetharamu, Kankanhally N.; Ishak, Abdul Azid, Dr.; Zainal Alimuddin, Zainal Alauddin, Dr. (Taylor & Francis Online, 2005)
      The present study investigates the heat transfer from a fin of the combination of cone and frustum of a cone immersed in boiling FC-72. The temperature distribution within the fin is determined with the help of a ...