Browsing Researchers by Author "Ibrahim, Ahmad"

Now showing items 1-4 of 4

    • Dicing die attach film for 3D stacked die QFN packages 

      Shahrum, Abdullah; S., Mohd Yusof; Ibrahim, Ahmad; Azman, Jalar; Ruslizam, Daud, Dr. (IEEE Conference Publications, 2012)
      The application of die attach film (DAF) in semiconductor packaging is become wider especially in three dimensional (3D) QFN stacked die package. As wafer getting thinner until beyond 100 μm, challenges in die attach process ...

    • The effect of temperature, pH and exposure time to Electroless Nickel Deposition for Under Bump Metallurgy (UBM) 

      Mohd Khairuddin, Md Arshad; Ibrahim, Ahmad; Azman, Jalar; Uda, Hashim (Universiti Putra Malaysia (UPM), 2005-12-06)
      The low cost deposition of under bump metallurgy (UBM) method presented in this paper is based on electroless nickel immersion gold (ENIG) bumping process. The study is focuses on the effect of temperature, pH and exposure ...

    • The effects of multiple zincation process on Aluminum Bond Pad surface for Electroless Nickel Immersion Gold deposition 

      Mohd Khairuddin, Md Arshad; Ibrahim, Ahmad; Azman, Jalar; Ghazali, Omar; Uda, Hashim (American Society of Mechanical Engineers (ASME), 2006-09)
      This paper reports the effects of a multiple zincation processon the Al bond pad surface prior to electroless nickel immersion gold deposition. The study of multiple zincation comprises the surface topogtaphy and morphology ...

    • A study for optimum productivity yield in 0.16μm mixed of wafer fabrication facility 

      Mohd Azizi, Chik; Ve, Chun Yung; Balakrishna, Puvaneswaran; Uda, Hashim, Prof. Dr.; Ibrahim, Ahmad; Bashir, Mohamad (Institute of Electrical and Electronics Engineers (IEEE), 2010-06-28)
      This research is to study the opportunity to achieve optimum productivity yield in 0.16μm product mixed through understanding the impact of loading utilization towards the capacity. The study is important to model the ...