Browsing Journal Articles by Subject "Packaging materials"
Now showing items 1-2 of 2
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The outcome of sintering parameters study toward the thermal properties of CuSiC composite
(Trans Tech Publications, 2014)Miniaturisation of electronic chips which have increasing functionality within the same package size has induced significant increases in requirements for extraction of heat from the integrated circuit (IC). Packaging ... -
The thermal expansion behaviors of Cu-SiCp composites
(Trans Tech Publications, 2013)The demand for advanced thermal management materials such as silicon carbide reinforced copper matrix (Cu-SiCp) composites is increasing due to their high thermal conductivity and low CTE properties. However, the weak ...