Now showing items 1-2 of 2

    • The outcome of sintering parameters study toward the thermal properties of CuSiC composite 

      Mohabattul Zaman, S NS Bukhari, Prof. Madya Ir.; M.S.J. Hashmi; Dermot, Brabazon (Trans Tech Publications, 2014)
      Miniaturisation of electronic chips which have increasing functionality within the same package size has induced significant increases in requirements for extraction of heat from the integrated circuit (IC). Packaging ...
    • The thermal expansion behaviors of Cu-SiCp composites 

      Azmi, Kamardin; Mohd Nazree, Derman, Dr.; Mohd Mustafa Al-Bakri, Abdullah (Trans Tech Publications, 2013)
      The demand for advanced thermal management materials such as silicon carbide reinforced copper matrix (Cu-SiCp) composites is increasing due to their high thermal conductivity and low CTE properties. However, the weak ...