Browsing School of Microelectronic Engineering (FYP) by Subject "Integrated circuits -- Materials"
Now showing items 1-2 of 2
-
Characterization of Electroless Under Bump Metallurgy for Alsi Bond Pad Composition
(Universiti Malaysia PerlisSchool of Microelectronic Engineering, 2007-03)The characterization of electroless under bump metallurgy for AlSi bond pad composition in term of surface morphology and surface roughness was investigated. By using the sample given, the gold layer need to be deposited ... -
Polysilicon Process Development – The Effect Of PECVD Process Parameters On The Film Characteristics
(Universiti Malaysia PerlisSchool of Microelectronic Engineering, 2007-03)Thin polycrystalline silicon film has been used in the wide range of applications in the production of integrated circuits and other electronic products. Traditionally, polycrystalline silicon is deposited using Low ...