Browsing School of Microelectronic Engineering (FYP) by Subject "Integrated circuits -- Design and construction"
Now showing items 1-6 of 6
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Characterization of Electroless Under Bump Metallurgy for Alsi Bond Pad Composition
(Universiti Malaysia PerlisSchool of Microelectronic Engineering, 2007-03)The characterization of electroless under bump metallurgy for AlSi bond pad composition in term of surface morphology and surface roughness was investigated. By using the sample given, the gold layer need to be deposited ... -
Improvement of SiGe HBT Design and Technology Performance using Device Simulation
(Universiti Malaysia PerlisSchool of Microelectronic Engineering, 2007-04)Simulation of the effect of various design parameters on the performance of the HBT is essential for obtaining the optimized design. This is based on the requirement for a reliable computation of the HBT performance. ... -
Simulation on Parameter and Characteristics Extraction Between Two Simulation Packages (Synopsys and PSpice)
(Universiti Malaysia PerlisSchool of Microelectronic Engineering, 2007-03)The progress of silicon technologies in the last twenty years has traced the path to the unprecedented revolution of information technologies, which has changed everybody’s lifestyles. Apparently, this has happened with ... -
Study in Design of 32 X 4Bit Static Random Access Memory (SRAM)
(Universiti Malaysia PerlisSchool of Microelectronic Engineering, 2007-04)Study in design Static Random Access Memory (SRAM) using Mentor Graphic and simulation process with Eldo simulator. The research made on the operation of six transistors, its advantage over Dynamic Random Access Memory ... -
Study of aspect ratio performance on Silicon Oxide wet etching by using Profilometer, AFM and SEM
(Universiti Malaysia PerlisSchool of Microelectronic Engineering, 2008-03)A study of aspect ratio performance on silicon oxide is developing to predict the oxide profile on surface of wafer. The main focus of this project is to perform and produce a high profile of silicon oxide under profiler ... -
Study of the temperature effect on thickness and surface roughness of SiO2
(Universiti Malaysia PerlisSchool of Microelectronic Engineering, 2008-04)Oxidation is one of the most important thermal processes in semiconductor fabrication. The profile of oxide layer is varied to its different applications. Many factors can affect the profile of the SiO2 layer. In this ...