Browsing School of Materials Engineering (FYP) by Subject "Tin-Copper (Sn - Cu)"
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Effect of corrosion in acidic solution to the phase and microstructure of SN-CU solder
(Universiti Malaysia Perlis (UniMAP)School of Materials Engineering, 2016-06)The effect of corrosion to the phase and microstructure for solder Sn-Cu solder in 1.0 MHCl was studied. The corrosion tests were carried out by potentiodynamic polarization method meanwhile the scan rate used was fixed ...