Search
Now showing items 1-1 of 1
Developing a mold technology module for freescale – study on effects of materials (compound properties) and molding process parameters on package moldability for QFP
(Universiti Malaysia Perlis, 2008-05)
In integrated circuit (IC) Packaging, there are several processes involved. The main processes for leaded package are wafer mount, wafer saw, die attach, wire bonding,
molding, plating, singulation, trim and form. Molding ...