Browsing Final Year Project Papers & Reports by Author "Tan Hui Khin"
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Developing a mold technology module for freescale – study on effects of materials (compound properties) and molding process parameters on package moldability for QFP
Tan Hui Khin (Universiti Malaysia PerlisSchool of Materials Engineering, 2008-05)In integrated circuit (IC) Packaging, there are several processes involved. The main processes for leaded package are wafer mount, wafer saw, die attach, wire bonding, molding, plating, singulation, trim and form. Molding ...