Mohd Arif Anuar Mohd Salleh, Associate Professor Dr. Ir.This page provides access to scholarly publications by UniMAP Faculty members and researchers.http://dspace.unimap.edu.my:80/xmlui/handle/123456789/341152024-03-28T09:48:11Z2024-03-28T09:48:11ZThe effect of thermal annealing on the microstructure and mechanical properties of Sn-0.7Cu-xZn solder jointMohd Izrul Izwan, RamliMohd Arif Anuar, Mohd SallehRita, Mohd SaidMohd Mustafa Al Bakri, AbdullahDewi Suriyani, Che HalinNorainiza, SaudNabiałek, Marcinhttp://dspace.unimap.edu.my:80/xmlui/handle/123456789/747582022-03-23T01:38:19Z2021-02-01T00:00:00ZThe effect of thermal annealing on the microstructure and mechanical properties of Sn-0.7Cu-xZn solder joint
Mohd Izrul Izwan, Ramli; Mohd Arif Anuar, Mohd Salleh; Rita, Mohd Said; Mohd Mustafa Al Bakri, Abdullah; Dewi Suriyani, Che Halin; Norainiza, Saud; Nabiałek, Marcin
The microstructural properties of a Pb-free solder joint significantly affect its mechanical behaviours. This paper details a systematic study of the effect of the annealing process on the microstructure and shear strength of a Zn-added Sn-0.7Cu solder joint. The results indicated that the IMC layer’s thickness at the solder/Cu interface increases with annealing time. The interfacial IMC layer of the Sn-0.7Cu solder joint gradually thickened with increasing annealing time and annealing temperature, while the interfacial IMC layer’s morphology changed from scallop-type to layer-type after the annealing process. However, the addition of 1.0 wt.% and 1.5 wt.% Zn in the Sn-0.7Cu effectively altered the interfacial IMC phase to Cu-Zn and suppressed the growth of Cu3Sn during the annealing process. The single-lap shear tests results confirmed that the addition of Zn decreased the shear strength of Sn-0.7Cu. The interfacial IMC of the Cu6Sn5 phase in Sn-0.7Cu changed to Cu-Zn due to the addition of Zn. The shear fractures in the annealed solder joint were ductile within the bulk solder instead of the interfacial IMC layer. Increased annealing time resulted in the increased presence of the Cu-Zn phase, which decreased the hardness and shear strength of the Sn-0.7Cu solder joint
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2021-02-01T00:00:00ZPerformance of Sn-3.0Ag-0.5Cu composite solder with kaolin geopolymer ceramic reinforcement on microstructure and mechanical properties under isothermal ageingNur Syahirah, Mohamad ZaimiMohd Arif Anuar, Mohd SallehSandu, Andrei VictorMohd Mustafa Al Bakri, AbdullahNorainiza, SaudShayfull Zamree, Abd RahimVizureanu, PetricaRita, Mohd SaidMohd Izrul, Izwan Ramlihttp://dspace.unimap.edu.my:80/xmlui/handle/123456789/747542022-03-23T01:25:40Z2021-02-01T00:00:00ZPerformance of Sn-3.0Ag-0.5Cu composite solder with kaolin geopolymer ceramic reinforcement on microstructure and mechanical properties under isothermal ageing
Nur Syahirah, Mohamad Zaimi; Mohd Arif Anuar, Mohd Salleh; Sandu, Andrei Victor; Mohd Mustafa Al Bakri, Abdullah; Norainiza, Saud; Shayfull Zamree, Abd Rahim; Vizureanu, Petrica; Rita, Mohd Said; Mohd Izrul, Izwan Ramli
This paper elucidates the effect of isothermal ageing at temperature of 85 °C, 125 °C and 150 °C for 100, 500 and 1000 h on Sn-3.0Ag-0.5Cu (SAC305) lead-free solder with the addition of 1 wt% kaolin geopolymer ceramic (KGC) reinforcement particles. SAC305-KGC composite solders were fabricated through powder metallurgy using a hybrid microwave sintering method and reflowed on copper substrate printed circuit board with an organic solderability preservative surface finish. The results revealed that, the addition of KGC was beneficial in improving the total thickness of interfacial intermetallic compound (IMC) layer. At higher isothermal ageing of 150 °C and 1000 h, the IMC layer in SAC305-KGC composite solder was towards a planar-type morphology. Moreover, the growth of total interfacial IMC layer and Cu3Sn layer during isothermal ageing was found to be controlled by bulk diffusion and grain-boundary process, respectively. The activation energy possessed by SAC305-KGC composite solder for total interfacial IMC layer and Cu3Sn IMC was 74 kJ/mol and 104 kJ/mol, respectively. Based on a lap shear test, the shear strength of SAC305-KGC composite solder exhibited higher shear strength than non-reinforced SAC305 solder. Meanwhile, the solder joints failure mode after shear testing was a combination of brittle and ductile modes at higher ageing temperature and time for SAC305-KGC composite solder.
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2021-02-01T00:00:00ZHybrid mold: comparative study of rapid and hard tooling for injection molding application using Metal Epoxy Composite (MEC)Radhwan, HussinSafian, SharifNabiałek, MarcinShayfull Zamree, Abd RahimMohd Tanwyn, Mohd KhushairiMohd Azlan, SuhaimiMohd Mustafa Al Bakri, AbdullahMohd Hazwan, Mohd HanidWysłocki, Jerzy J.Bloch, Katarzynahttp://dspace.unimap.edu.my:80/xmlui/handle/123456789/747532022-03-23T01:23:08Z2021-02-01T00:00:00ZHybrid mold: comparative study of rapid and hard tooling for injection molding application using Metal Epoxy Composite (MEC)
Radhwan, Hussin; Safian, Sharif; Nabiałek, Marcin; Shayfull Zamree, Abd Rahim; Mohd Tanwyn, Mohd Khushairi; Mohd Azlan, Suhaimi; Mohd Mustafa Al Bakri, Abdullah; Mohd Hazwan, Mohd Hanid; Wysłocki, Jerzy J.; Bloch, Katarzyna
The mold-making industry is currently facing several challenges, including new competitors in the market as well as the increasing demand for a low volume of precision moldings. The purpose of this research is to appraise a new formulation of Metal Epoxy Composite (MEC) materials as a mold insert. The fabrication of mold inserts using MEC provided commercial opportunities and an alternative rapid tooling method for injection molding application. It is hypothesized that the addition of filler particles such as brass and copper powders would be able to further increase mold performance such as compression strength and thermal properties, which are essential in the production of plastic parts for the new product development. This study involved four phases, which are epoxy matrix design, material properties characterization, mold design, and finally the fabrication of the mold insert. Epoxy resins filled with brass (EB) and copper (EC) powders were mixed separately into 10 wt% until 30 wt% of the mass composition ratio. Control factors such as degassing time, curing temperature, and mixing time to increase physical and mechanical properties were optimized using the Response Surface Method (RSM). The study provided optimum parameters for mixing epoxy resin with fillers, where the degassing time was found to be the critical factor with 35.91%, followed by curing temperature with 3.53% and mixing time with 2.08%. The mold inserts were fabricated for EB and EC at 30 wt% based on the optimization outcome from RSM and statistical ANOVA results. It was also revealed that the EC mold insert offers better cycle time compared to EB mold insert material.
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2021-02-01T00:00:00ZMicrostructure evolution of Ag/TiO₂ thin filmDewi Suriyani, Che HalinKamrosni, Abdul RazakMohd Arif Anuar, Mohd SallehMohd Izrul Izwan, RamliMohd Mustafa Al Bakri, AbdullahAyu Wazira, AzhariKazuhiro, NogitaHideyuki, YasudaNabiałek, MarcinWysłocki, Jerzy J.http://dspace.unimap.edu.my:80/xmlui/handle/123456789/747522022-03-23T01:17:30Z2021-01-01T00:00:00ZMicrostructure evolution of Ag/TiO₂ thin film
Dewi Suriyani, Che Halin; Kamrosni, Abdul Razak; Mohd Arif Anuar, Mohd Salleh; Mohd Izrul Izwan, Ramli; Mohd Mustafa Al Bakri, Abdullah; Ayu Wazira, Azhari; Kazuhiro, Nogita; Hideyuki, Yasuda; Nabiałek, Marcin; Wysłocki, Jerzy J.
Ag/TiO₂ thin films were prepared using the sol-gel spin coating method. The microstructural growth behaviors of the prepared Ag/TiO₂ thin films were elucidated using real-time synchrotron radiation imaging, its structure was determined using grazing incidence X-ray diffraction (GIXRD), its morphology was imaged using the field emission scanning electron microscopy (FESEM), and its surface topography was examined using the atomic force microscope (AFM) in contact mode. The cubical shape was detected and identified as Ag, while the anatase, TiO₂ thin film resembled a porous ring-like structure. It was found that each ring that coalesced and formed channels occurred at a low annealing temperature of 280 °C. The energy dispersive X-ray (EDX) result revealed a small amount of Ag presence in the Ag/TiO₂ thin films. From the in-situ synchrotron radiation imaging, it was observed that as the annealing time increased, the growth of Ag/TiO₂ also increased in terms of area and the number of junctions. The growth rate of Ag/TiO₂ at 600 s was 47.26 µm²/s, and after 1200 s it decreased to 11.50 µm²/s and 11.55 µm²/s at 1800 s. Prolonged annealing will further decrease the growth rate to 5.94 µm²/s, 4.12 µm2/s and 4.86 µm²/s at 2400 s, 3000 s and 3600 s, respectively.
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2021-01-01T00:00:00Z