Ruslizam Daud, Assoc Prof. Ir. Dr.This page provides access to scholarly publications by UniMAP Faculty members and researchers.http://dspace.unimap.edu.my:80/xmlui/handle/123456789/330292024-03-29T14:55:15Z2024-03-29T14:55:15ZStress intensity factors under combined bending and torsion momentsAl Emran, IsmailAhmad Kamal, AriffinShahrum, AbdullahMariyam Jameelah, GhazaliMohammed Abdulrazzaqhttp://dspace.unimap.edu.my:80/xmlui/handle/123456789/352142014-06-09T08:50:43Z2012-01-01T00:00:00ZStress intensity factors under combined bending and torsion moments
Al Emran, Ismail; Ahmad Kamal, Ariffin; Shahrum, Abdullah; Mariyam Jameelah, Ghazali; Mohammed Abdulrazzaq
This paper discusses stress intensity factor (SIF) calculations for surface cracks in round bars subjected to combined torsion and bending loadings. Different crack aspect ratios, a/b, ranging from 0.0 to 1.2 and relative crack depths, a/D, ranging from 0.1 to 0.6 were considered. Since the loading was non-symmetrical for torsion loadings, a whole finite element model was constructed. Then, the individual and combined bending and torsion loadings were remotely applied to the model. The equivalent SIF method, F*EQ, was then used explicitly to combine the individual SIFs from the bending and torsion loadings. A comparison was then carried out with the combined SIF, F*FE, obtained using the finite element analysis (FEA) under similar loadings. It was found that the equivalent SIF method successfully predicted the combined SIF for Mode I. However, discrepancies between the results determined from the different approaches occurred when FIII was involved. It was also noted that the predicted F*FE using FEA was higher than the F*EQ predicted through the equivalent SIF method due to the difference in crack face interactions.
Link to publisher's homepage at http://ieeexplore.ieee.org
2012-01-01T00:00:00ZDicing die attach film for 3D stacked die QFN packagesShahrum, AbdullahS., Mohd YusofIbrahim, AhmadAzman, JalarRuslizam, Daud, Dr.http://dspace.unimap.edu.my:80/xmlui/handle/123456789/352132014-06-09T08:50:09Z2012-01-01T00:00:00ZDicing die attach film for 3D stacked die QFN packages
Shahrum, Abdullah; S., Mohd Yusof; Ibrahim, Ahmad; Azman, Jalar; Ruslizam, Daud, Dr.
The application of die attach film (DAF) in semiconductor packaging is become wider especially in three dimensional (3D) QFN stacked die package. As wafer getting thinner until beyond 100 μm, challenges in die attach process become greater and die attach paste may not be suitable in most cases. DAF has many advantages including no die tilt, no void, consistent bond line, no bleed out which improves the real estate on the bottom die. This paper reveals the difference of two types of DAF. In dicing die attach film (DDAF) application for QFN stacked die, there are several common responses so the focus will be elucidated the common defect after lamination process and dicing process. Defect like bubble, whisker formation, adhesive merging and flying die are for lamination process. While, chipping at backside, front side and sidewall, and also crack will be inspected for the dicing process. Lamination parameters such as temperature, pressure and speed will be optimized in order to get the best parameter combination for these two types of DAF. In the dicing process the critical parameter such as spindle rotation, saw speed, and blade grit size will be determined based on experimental works. Qualitative analysis will be carried out in order to understand the chipping, crack, adhesive merging and whisker formation. Tools like high power microscope (50x - 500 x magnificent) and SEM will be used to see those defect. The results that show all two types of DAF give the same response at the same parameter setting were presented and thoroughly discussed.
Proceedings of the 32nd IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium 2007 at San Jose, CA, United States on 3 October 2007 through 5 October 2007. Link to publisher's homepage at http://ezproxy.unimap.edu.my:2080/Xplore/dynhome.jsp?tag=1
2012-01-01T00:00:00ZProduct assembly sequence optimization based on genetic algorithmAzman, YasinNurnasran, PutehRuslizam, Daud, Dr.Mazni, OmarSharifah Lailee, Syed-Abdullahhttp://dspace.unimap.edu.my:80/xmlui/handle/123456789/352122014-06-09T08:49:16Z2010-12-01T00:00:00ZProduct assembly sequence optimization based on genetic algorithm
Azman, Yasin; Nurnasran, Puteh; Ruslizam, Daud, Dr.; Mazni, Omar; Sharifah Lailee, Syed-Abdullah
Genetic algorithm (GA) is a search technique used in computing to find approximate solution to optimization and search problem based on the theory of natural selection. This study investigates the application of GA in optimizing product assembly sequences. The objective is to minimize the time taken for the parts to be assembled into a unit product. A single objective GA is used to obtain the optimal assembly sequence, exhibiting the minimum time taken. The assembly experiment is done using a case study product and results were compared with manual assembly sequences using the ‘Design for Assembly’ (DFA) method. The results indicate that GA can be used to
obtain a near optimal solution for minimizing the process time in sequence assembly. This shows that GA can be applied as a tool for assembly sequence planning that can be implemented at the design process to obtain faster result than the traditional
methods.
Link to publisher's homepage at http://www.enggjournals.com/
2010-12-01T00:00:00ZJ-integral analysis of surface cracks in round bars under combined loadingsA. Emran, IsmailAhmad Kamal, AriffinShahrum, AbdullahMariyam Jameelah, GhazaliRuslizam, Daud, Dr.http://dspace.unimap.edu.my:80/xmlui/handle/123456789/352112014-06-09T08:46:18Z2011-02-01T00:00:00ZJ-integral analysis of surface cracks in round bars under combined loadings
A. Emran, Ismail; Ahmad Kamal, Ariffin; Shahrum, Abdullah; Mariyam Jameelah, Ghazali; Ruslizam, Daud, Dr.
This paper presents a non-linear numerical investigation of surface cracks in round bars under combined bending and torsion loadings by using ANSYS finite element analysis (FEA). Due to the non-symmetrical analysis, a full finite element (FE) model was constructed and special attention was given at the crack tip of the cracks. The surface cracks were characterized by the dimensionless crack aspect ratio, a/b = 0.6, 0.8, 1.0 and 1.2, while the dimensionless relative crack depth, a/D = 0.1, 0.2 and 0.3. The square-root singularity of stresses and strains was modeled by shifting the mid-point nodes to the quarter-point locations in the region around the crack front. The proposed model was validated with the existing model before any further analysis. The elastic-plastic analysis under the loading was assumed to follow the Ramberg-Osgood relation with strain hardening exponent, n = 5 and 10. J values were determined for all positions along the crack front and then, the limit load was predicted using the J values obtained from FEA through the reference stress method.
Link to publisher's homepage at http://www.ttp.net/
2011-02-01T00:00:00Z