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Flip chip thermal test vehicle design: Requirements, evaluations, and validations
(ASME, 2003)
This paper reviews the design of a flip chip thermal test vehicle. Design requirements for different applications such as thermal characterization, assembly process optimization, and product burn-in simulation are outlined. ...
Thermal management of multichipmodule (MCM) using genetic algorithms
(IEEE Conference Publications, 2003)
The placement of power dissipating chips for a multichip module (MCM) is carried out using genetic algorithms. Since high power is to be dissipated over a small area of a module, the heat must be conducted away efficiently. ...
Fast transient solutions for heat transfer [FEM]
(IEEE Conference Publications, 2003)
The implementation of the finite element method (FEM) in thermal analysis usually produces a formulation in the space/time domain. This kind of space/time domain formulation leads to a set of ordinary differential equations ...
Steady state finite element analysis of a double stack cold plate with heat losses
(Springer-Verlag, 2003)
A generalised formulation of the steady state analysis of a double stack cold plate, with and without heat losses from their top and bottom surfaces using dimensionless parameters, is carried out. Galerkin's weighted ...