Browsing by Subject "Scanning electron microscope (SEM)"

Now showing items 1-7 of 7

    • Chemical & Mineralogical Properties of Fly Ash 

      Khairul Nizar, Ismail; Kamarudin, Hussin; Mohd Sobri, Idris (Malaysian Nuclear Society, 2007)
      Fly ash is the finely divided mineral residue resulting from the combustion of coal in electric generating plants. Fly ash consists of inorganic, incombustible matter present in the coal that has been fused during combustion ...

    • The effect of duration aging temperature on fatigue strength of aluminum alloy strength of aluminum alloy 

      Ahmad Syayuthi, Abdul Rahman; Haftirman; Teo, Ee Lynn (Universiti Malaysia Perlis (UniMAP)Pusat Pengajian Kejuruteraan Mekatronik, 2012-02-27)
      This paper present the effect of different duration aging temperature on fatigue strength of Al6063. Al 6063 alloy specimens have been solution heat treated at 520C for 2 hours. Subsequently, the artificial ageing heat ...

    • An examination of the evidence of abrasive wear in the wearing process of aluminium reinforced with slag particles using SEM 

      Zamri, Yusoff; Shamsul Baharin, Jamaludin, Prof. Dr.; Misbahul, Amin (Universiti Malaysia Perlis (UniMAP)Centre for Graduate Studies, 2010-10-16)
      The two-body abrasive wear behavior of pure aluminum reinforced with slag particles has been investigated. The aluminum matrix composites were fabricated by powder metallurgy technique by mixing pure aluminum with slag ...

    • Formation of Si nanostructure using size reduction technique 

      Th., Shikra Dhahi; Uda, Hashim, Prof. Dr.; N. M., Ahmed (Universiti Malaysia Perlis (UniMAP)Centre for Graduate Studies, 2010-10-16)
      A simple method for the fabrication of nanogaps using conventional photolithography combined with pattern-size reduction techniques is presented. Silicon material is used to fabricate the nanogap structure and gold is used ...

    • Microstructure evolution of Sn-3.5Ag-1.0Cu-0.5Ni/Cu system lead free solder under long term thermal aging 

      Noor Asikin, Ab Ghani; Iziana, Yahya; Mohd Arif Anuar, Mohd Salleh; Saidatulakmar, Shamsuddin; Zainal Arifin, Ahmad; Ramani, Mayappan (Scientific.Net, 2012-12)
      Due to environmental concerns, lead-free solders were introduced in replacing the lead-based solders in microelectronics devices technology. Although there are many lead-free solder available, the Sn-Ag-Cu solder was ...

    • Properties of paper waste sludge reinforced with sugarcane bagasse 

      Mohd Azrauhisham, Sudin (Universiti Malaysia Perlis (UniMAP)School of Environmental Engineering, 2010)
      In this study, the raw materials used are treated paper waste sludge and sugar cane bagasse. This study aims on the properties of both industrial and agricultural wastes and the effects of the wastes blending by combining ...

    • The surface morphology characterization of electroless nickel immersion gold under bump metallurgy (UBM) using SEM 

      Mohd Khairuddin, Md Arshad; Mohd Nazrin, Md Isa; Sohiful Anuar, Zainol Murad (American Institute of Physics, 2007-05-09)
      This paper presents the surface morphology characterization at each process step in electroless nickel immersion gold (ENIG) deposition using Scanning Electron Microscope (SEM). The characterization start at initial bond ...