Now showing items 1-3 of 3

    • Optimization of fins used in electronic packaging 

      Ong, Kang Eu; Lee, Kor Oon; Seetharamu, Kankanhally N.; Ishak, Abdul Azid, Dr.; Ghulam, Abdul Quadir, Prof. Dr.; Zainal Alimuddin, Zainal Alauddin, Dr.; Goh, Teck Joo (Emerald Group Publishing Limited, 2005)
      Purpose-To find the optimal geometries of rectangular and cylindrical fins for maximum heat dissipation. Design/methodology/approach- The objective function for finding the optimized profiles of fins are solved by using ...
    • Thermal investigations of microelectronic chip with non-uniform power distribution: temperature prediction and thermal placement design optimization 

      Goh, Teck Joo; Seetharamu, Kankanhally N.; Ghulam, Abdul Quadir, Prof. Dr.; Zainal Alimuddin, Zainal Alauddin, Dr.; Ganeshamoorthy, K. Jeevan (Emerald Group Publishing Limited, 2004)
      This paper presents the thermal analyses carried out to predict the temperature distribution of the silicon chip with non-uniform power dissipation patterns and to determine the optimal locations of power generating sources ...
    • Thermal management of multi-chip module and printed circuit board using FEM and genetic algorithms 

      Jeevan, Kanesan; Ghulam, Abdul Quadir, Prof. Dr.; Seetharamu, Kankanhally N.; Ishak, Abdul Azid, Dr. (Emerald Group Publishing Limited, 2005)
      Purpose - To determine the optimal chip/component placement for multi-chip module (MCM) and printed circuit board (PCB) under thermal constraint. Design/methodology/approach - The placement of power dissipating chips/component ...