Browsing by Subject "Platinum"
Now showing items 1-5 of 5
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Investigation of surface roughness on platinum deposited wafer after reactive ion etching using SF₆+Argon gaseous
(Trans Tech Publications, 2014)This paper investigates the factors that affect the surface roughness on a Platinum deposited wafer after reactive ion etching (RIE) using a combination of SF₆ and Argon gaseous. A total of three controllable process ... -
The role of sodium surface species on electrochemical promotion of catalysis in a Pt/YSZ system: The case of ethylene oxidation
(Elsevier Inc., 2013-07)The role of sodium addition as foreign (impurity) species on the electrochemical promotion of ethylene oxidation in a Pt/YSZ system was investigated. It was found that the presence of sodium surface species on the catalyst ... -
Surface roughness and wettability correlation on etched platinum using reactive ion ecthing
(Trans Tech Publications, 2014-01)As the world of semiconductor is moving towards smaller and high-end applications, the quality of the bonding adhesion for wire bonding is very critical. Although aluminium has been the metallization of choice in integrated ... -
Surface roughness scrutinizaton with RIE CF₄+Argon gaseous on platinum deposited wafer
(Trans Tech Publications, 2014)Aluminium metallization has a disadvantage when it comes to high-end applications as it cannot withstand the high temperature and pressure. This paper studies the factors that affect the surface roughness on a Platinum ... -
Wettability analysis on platinum deposited wafer after reactive ion ecthing using SF6+argon/CF4+argon gaseous
(AENSI Publisher All rights reserved, 2013-10)Wettability in microfluidic has direct influence to its fluid flow channels. This paper investigates the variable parameters that affect the wetability in terms of contact angle on a Platinum deposited wafer after reactive ...