Browsing by Subject "Electronic packaging"

Now showing items 1-4 of 4

    • Aging effect of Sn-Ag-Cu lead free solder 

      Mohd Jeffry, Radzi (Universiti Malaysia PerlisSchool of Materials Engineering, 2008-03)
      Many issue related to the performance of lead free solder alloys have arisen. So, it should be take concern on it and one of the method is by studying the microstructure of those solder alloys. This because their mechanical ...

    • Evaluation on metal matrix composite of CuSiC as candidate for thermal management materials in electronics packaging 

      Mohabattul Zaman, S NS Bukhari, Prof. Madya Ir.; Brabazon D.; M.S.J. Hashmi (Universiti Malaysia Perlis (UniMAP), 2012-06-18)
      In the quest to pack into ever shrinking cell phone, digital audio players or personal digital assistance (PDA), which will definitely helps to ensure the electronic equipment does not overheat, fail or malfunction, ...

    • Optimization of Gating system in semiconductor packaging 

      F.Y. Lim; S. Abdullah; I. Ahmad (Universiti Malaysia Perlis, 2009-10-11)
      The development of three dimensional semiconductor packaging with embedded microchannel heat sinks were undertaken. Main purpose of the investigation was to gain more insights on the characteristics of the fluid flow ...

    • The properties of epoxy resin coated silica fillers composites 

      Teh, Pei Leng, Dr.; Mariatti, Mustapha; Hazizan, Md Akil; Yeoh, Cheow Keat, Dr.; Seetharamu, Kankanhally N.; Amir Nur Rashid, Wagiman; Beh, Keh Shin (Elsevier Ltd., 2007-05)
      Epoxy resin coated silica fillers composites with high percentage of filler loading, such as 80 to 95 vol.% are able to be produced by a mechanical mixing technique. The advantages of high filler loading of theses materials ...