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    • Growth of Cu-Zn5 and Cu5Zn8 intermetallic compounds in the Sn-9Zn/Cu joint during liquid state aging 

      Ramani, Mayappan; Rosyaini, A. Zaman; Zalina, Z. Abidin; Asmawati@FatinNajihah, Alias; Mohd N., Derman (Universiti Malaysia PerlisSchool of Materials Engineering & School of Environmental Engineering, 2010-06-09)
      The phase and intermetallic thickness of Cu-Zn5 and Cu5Zn8 has been investigated under liquid state aging using reflow method. Both the intermetallic was formed by reacting Sn-9Zn lead free solder with copper substrate. ...