Now showing items 1-3 of 3

    • Finite element analysis of thermal distributions of solder ball in flip chip ball grid array using ABAQUS 

      Yap, Boon Kar, Dr.; Noor Azrina, Talik; Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan (Emerald Group Publishing Limited, 2013)
      Purpose - The increased use recently of area-array technology in electronic packaging has similarly increased the importance of predicting the thermal distribution of area-array solder interconnection. As the interconnection ...
    • On a novel method of vehicle wheel ring production 

      M.R. Ayatollahi; R. Ghafoori Ahangar; M. Amini (Universiti Malaysia Perlis (UniMAP)Pusat Pengajian Kejuruteraan Mekatronik, 2012-02-27)
      In this paper, a novel method for vehicle steel wheel ring production has been presented. In the conventional methods of ring production, firstly, the blank changes to a cup through the deep drawing process and then ...
    • Structural behaviour of Putra block under axial load using FEM 

      Ken, Pang Wei; Abdul Aziz, Abdul Samad, Ir. Dr.; Inn, Dr. Goh Wan; Noridah, Mohamad, Dr.; Mohamad Zulhairi, Mohd Bosro; Muhammad Afiq, Tambichik (The Institution of Engineers, Malaysia (IEM), 2018-06)
      Interlocking hollow block (IHB) system is a new building technology which eliminates the mortar layer and instead provides a key connection (protrusions and grooves) to interconnect the blocks. With respect to the mortarless ...