Browsing by Author "nisikawa@jwri.osaka-u.ac.jp"
Now showing items 1-2 of 2
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Copper-filled electrically conductive adhesives with enhanced shear strength
Ho, Li Ngee, Dr.; Hiroshi, Nishikawa (ASM International, 2014-09)In this study, the effects of diethyl carbitol (diluent) and tertiary amines on the electrical, mechanical, and rheological properties of the Cu-filled polyurethane-based electrically conductive adhesives (ECAs) were ... -
Properties of phenolic-based Ag-filled conductive adhesive affected by different coupling agents
Ho, Li Ngee, Dr.; Teng, Fei Wu; Hiroshi, Nishikawa (Taylor and Francis Group, LLC., 2013-11)In this study, a phenolic-based Ag flake-filled electrically conductive adhesive (ECA) was investigated in terms of rheological, electrical, and mechanical properties. To clarify the effect of various Ag flake filler content ...