Browsing by Author "intanniza@yahoo.com"

Now showing items 1-2 of 2

    • Isothermal annealing induced phase Coarsening in Sn-Ag-Cu and Sn-Ag solders 

      Norainiza, Saud; Azman, Jalar (Universiti Malaysia Perlis, 2009-12-01)
      The microstructure study of eutectic Sn-Ag-Cu (SAC) and Sn-Ag solders during isothermal annealing has been investigated. Isothermal annealing temperatures were from 60ºC, to 150ºC for 24 up to 1008 hours of anneal time. ...

    • Research development of solder materials and its intermetallic compound (IMC) study 

      Mohd Arif Anuar, Mohd Salleh; Najib Saedi, Ibrahim; Saud, N.; Mohd Mustafa Al Bakri, Abdullah; Nik Noriman, Zulkepli; Ramani, Mayapan; Zainal Ariffin, Ahmad (Scientific.Net/Trans Tech Publications, 2012-12)
      Nowadays, the formation and the subsequent growth of the intermetallic compounds (IMCs) and the development of new lead-free solder systems is a major issue in soldering. The excessive growth formation of intermetallic ...