Browsing by Author "ghazali@utem.edu.my"
Now showing items 1-4 of 4
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Diffusion mechanism of silver particles in polymer binder for die attach interconnect technology
Siti Rahmah, Esa; Genesia, Omar; Siti Hajar, Sheikh Md Fadzullah; Kim, S. Siow; B. Abdul Rahim; B. Çoşut (Universiti Malaysia Perlis (UniMAP), 2020-05)Sintered Ag has gained strong interest as an important alternative material for interconnect technology in wide bandgap (WBG) semiconductor industries specifically for high thermal dissipations and high-speed applications. ... -
The effect of temperature on the electrical conductivity and microstructure behaviour of silver particles
A. M., Yunos; G., Omar; M. A, Salim; N. A., Masripan; Mohammed Hussin Ahmed Al-Mola (Universiti Malaysia Perlis (UniMAP), 2020-05)Silver conductive ink has been used in the electronics industry due to their potential advantages such as high electrical conductivity and thermal conductivity. However, silver needs to undergo a curing process to reduce ... -
The evolutions of microstructure in pressureless Sintered Silver die attach material
S.R., Esa; G., Omar; S.H. Sheikh, Md Fadzullah; K.S Siow; B., Abdul Rahim (Universiti Malaysia Perlis (UniMAP), 2021-04)Sintered silver (Ag) is one of the most promising interconnect materials for high temperature electronics applications due to its potential to withstand harsh and extreme environments. This paper investigates the microstructure ... -
Thermo-mechanical and adhesion performance of Silver-Filled Conductive Polymer Composite (SFCP) using Thermoplastic Polyurethane (TPU) Substrate
A. S., Ashikin; G., Omar; N., Tamaldin; S., Jasmee; H. A., Hamid; A., Jalar; F., Che Ani (Universiti Malaysia Perlis (UniMAP), 2020-05)Emerging of conductive metal filler in nanoscale like Silver-Filled Conductive Polymer Composite (SFCP) ink is one of the important technology for electronic interconnects future. Among the key challenges in the successful ...