Browsing by Author "Sayyidah Amnah, Musa"

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    • Development of Sn-Cu filled activated carbon composite solder via powder metallurgy technique 

      Sayyidah Amnah, Musa
      The revolution of electronic applications which have been assembled in smaller parts, lighter and more functional, causes the solder to become crucial over the worlds. These classes of low melting point alloys must provide ...

    • SAC-SIC : a new potential lead–free composite solder for green technology 

      Zawawi, Mahim; Sayyidah Amnah, Musa; Noraniza, Saud; Nurul Razliana, Abdul Razak (Universiti Malaysia Perlis (UniMAP), 2015-04-17)
      Recently, the development of Sn-Ag-Cu (SAC) has gain attention in electronic packaging industry due to its good reliability in the electronics application. The tin-silver-copper family of alloys has earned a great deal ...

    • Zn-Sn based high temperature solder - A short review 

      Sayyidah Amnah, Musa; Mohd Arif Anuar, Mohd Salleh; Norainiza, Saud (Trans Tech Publications, 2013)
      The developments of lead-free solders have become a major concern to the researchers in electronic industry to replace the lead-containing materials. The concern is not just for low temperature solders but also for high ...