Browsing by Author "Ramani, Mayappan"

Now showing items 1-2 of 2

    • Growth of Cu-Zn5 and Cu5Zn8 intermetallic compounds in the Sn-9Zn/Cu joint during liquid state aging 

      Ramani, Mayappan; Rosyaini, A. Zaman; Zalina, Z. Abidin; Asmawati@FatinNajihah, Alias; Mohd N., Derman (Universiti Malaysia PerlisSchool of Materials Engineering & School of Environmental Engineering, 2010-06-09)
      The phase and intermetallic thickness of Cu-Zn5 and Cu5Zn8 has been investigated under liquid state aging using reflow method. Both the intermetallic was formed by reacting Sn-9Zn lead free solder with copper substrate. ...

    • Microstructure evolution of Sn-3.5Ag-1.0Cu-0.5Ni/Cu system lead free solder under long term thermal aging 

      Noor Asikin, Ab Ghani; Iziana, Yahya; Mohd Arif Anuar, Mohd Salleh; Saidatulakmar, Shamsuddin; Zainal Arifin, Ahmad; Ramani, Mayappan (Scientific.Net, 2012-12)
      Due to environmental concerns, lead-free solders were introduced in replacing the lead-based solders in microelectronics devices technology. Although there are many lead-free solder available, the Sn-Ag-Cu solder was ...