Browsing by Author "Nishikawa, Hiroshi"
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Effect of different copper fillers on the electrical resistivity of conductive adhesives
Li-Ngee, Ho; Nishikawa, Hiroshi; Takemoto, Tadashi (Springer Science+Business Media, LLC, 2011-05)The effects of different copper fillers with different morphology and particle size have been studied in terms of electrical resistivity and thermal stability on the electrically conductive adhesives. The copper fillers ... -
Electrical properties of pre-alloyed Cu-P containing electrically conductive adhesive
Ho, Li Ngee; Tang, Fei Wu; Nishikawa, Hiroshi; Takemoto, Tadashi (Taylor & Francis, 2010-08)In this study, a pre-alloyed Cu-P powder with a trace amount of P (0.002 at.%) was used as a metallic filler in a phenolic resin-based electrically conductive adhesive (ECA). The electrical property of the Cu-P-filled ECA ... -
Electrical reliability of different alloying content on copper alloy fillers in electrically conductive adhesives
Lin-Ngee, Ho; Teng, Fei Wu; Nishikawa, Hiroshi; Takemoto, Tadashi; Miyake, Koichi; Fujita, Masakazu; Ota, Koyu (Springer, 2011)The thermal stability and electrical reliability of electrically conductive adhesives (ECAs) filled with Cu fillers alloying with different amount of Ag and Mg (0.2-1.5 at.%), respectively, were studied by comparing their ... -
Surfactant-free synthesis of copper particles for electrically conductive adhesive applications
Ho, Li Ngee; Nishikawa, Hiroshi (TMS, 2012-09)In this study, a simple one-step microwave-assisted method was developed to synthesize Cu and Cu-Ag particles for application in electrically conductive adhesive (ECA). The particle size of the obtained Cu particles was ...