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    • Numerical analysis of GNP/Ag Die-Attach adhesives with different thermal conductivity 

      Ameeruz Kamal, Ab Wahid; Mohd Azli, Salim; Nor Azmmi, Masripan; Chonlatee, Photong; Adzni, Md. Saad; Mohd Zaid, Akop; Muhd Ridzuan, Mansor (Universiti Malaysia Perlis (UniMAP), 2022-03)
      The thermal conductivities of a multilayer model of GNP/Ag hybrid die-attach material are explored using steady-state thermal modeling. The heat flux in multilayer GNP/Ag hybrid structures is shown to be highly layer ...