Browsing by Author "Fatin Afeeqa, Mohd Sobri"

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    • Graphite as an intermetallic compound (IMC) substitution for a robust solder joint 

      Fatin Afeeqa, Mohd Sobri; Norhayanti, Mohd Nasir; Rita, Mohd Said; Mohd Izrul Izwan, Ramli; Muhammad Hafiz, Zan@Hazizi; Azmi, Kamardin; Mohd Arif Anuar, Mohd Salleh (Universiti Malaysia Perlis (UniMAP), 2015-04-17)
      Conventionally, Sn-Pb types of solder were highly used in the electronic packaging industries as it excels in most of its properties. But, then it was realized that lead (Pb) were hazardous to the invironment and human ...

    • Hot air solder levelling (HASL) process parameters optimization for SN100CL 

      Fatin Afeeqa, Mohd Sobri
      Reliability of electronic packaging has now become the most critical factor in electronic industries. The prediction of solder joint failure and its shelf life becomes more challenging as the increasing demand for superior ...