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    • The evolutions of microstructure in pressureless Sintered Silver die attach material 

      S.R., Esa; G., Omar; S.H. Sheikh, Md Fadzullah; K.S Siow; B., Abdul Rahim (Universiti Malaysia Perlis (UniMAP), 2021-04)
      Sintered silver (Ag) is one of the most promising interconnect materials for high temperature electronics applications due to its potential to withstand harsh and extreme environments. This paper investigates the microstructure ...