Browsing by Title
Now showing items 56071-56090 of 79077
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Polymer Composites
(Universiti Malaysia Perlis (UniMAP), 2014-01-03) -
Polymer Composites
(2010-11-22) -
Polymer Composites
(Universiti Malaysia Perlis (UniMAP), 2018-01) -
Polymer Composites
(Universiti Malaysia Perlis (UniMAP), 2016-12) -
Polymer composites
(Universiti Malaysia Perlis (UniMAP), 2018-12) -
Polymer core BGA stress analysis at minimal vertical loading
(Trans Tech Publications, 2012-12)Ball grid array is an interconnection method widely used in the electronic packaging industry. The reliability of the solder ball is being improved by introducing new materials for the solder ball. In this study, the stress ... -
Polymer Engineering Design
(Universiti Malaysia Perlis (UniMAP), 2015-01-07) -
Polymer Engineering Design
(Universiti Malaysia Perlis (UniMAP), 2013-01-12) -
Polymer Engineering Design
(Universiti Malaysia Perlis (UniMAP), 2013-12-31) -
Polymer Engineering Design
(Universiti Malaysia Perlis (UniMAP), 2013-12-31) -
Polymer Engineering Design
(Universiti Malaysia Perlis (UniMAP), 2016-12) -
Polymer Engineering Design
(Universiti Malaysia Perlis (UniMAP), 2018-01) -
Polymer Engineering Design
(Universiti Malaysia Perlis (UniMAP), 2018-12) -
Polymer Engineering Product
(Universiti Malaysia Perlis (UniMAP), 2013-06-13) -
Polymer in Electronic Application
(Universiti Malaysia Perlis (UniMAP), 2015-01-14) -
Polymer in Electronic Application
(Universiti Malaysia Perlis (UniMAP), 2013-01-08) -
Polymer in Electronic Application
(Universiti Malaysia Perlis (UniMAP), 2014-01-17) -
Polymer in Electronic Application
(2010-11-29) -
Polymer in Electronic Application
(Universiti Malaysia Perlis (UniMAP), 2018-01) -
Polymer in Electronic Application
(Universiti Malaysia Perlis (UniMAP), 2016-12)