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dc.contributor.authorRamani, Mayappan-
dc.contributor.authorRosyaini, A. Zaman-
dc.contributor.authorZalina, Z. Abidin-
dc.contributor.authorAsmawati@FatinNajihah, Alias-
dc.contributor.authorMohd N., Derman-
dc.date.accessioned2010-08-24T09:10:33Z-
dc.date.available2010-08-24T09:10:33Z-
dc.date.issued2010-06-09-
dc.identifier.citationp.123-127en_US
dc.identifier.isbn978-967-5760-02-0-
dc.identifier.urihttp://dspace.unimap.edu.my/123456789/9060-
dc.descriptionInternational Conference on X-Rays and Related Techniques in Research and Industry (ICXRI 2010) jointly organized by Universiti Malaysia Perlis (UniMAP) and X-Ray Application Malaysia Society (XAPP), 9th - 10th June 2010 at Aseania Resort Langkawi, Malaysia.en_US
dc.description.abstractThe phase and intermetallic thickness of Cu-Zn5 and Cu5Zn8 has been investigated under liquid state aging using reflow method. Both the intermetallic was formed by reacting Sn-9Zn lead free solder with copper substrate. Scanning electron microscope (SEM) was used to see the morphology of the phases and energy dispersive x-ray (EDX) was used to estimate the elemental compositions of the phases. The morphology of the Cu5Zn8 phase was rather flat but when the soldering temperature and tine increases, the morphology becomes scallop. Intermetallic thickness measurements show that the thickness of the Cu-Zn5 decreases with increasing soldering time and temperature. Whereas, the thickness of the Cu5Zn8 intermetallic increases with soldering time and temperature.en_US
dc.language.isoenen_US
dc.publisherUniversiti Malaysia Perlisen_US
dc.relation.ispartofseriesProceedings of the International Conference on X-Rays & Related Techniques in Research & Industry (ICXRI) 2010en_US
dc.subjectCu5Zn8 Intermetallicen_US
dc.subjectLead-free Solderen_US
dc.subjectSn-Zn Solderen_US
dc.subjectEnergy dispersive x-ray (EDX)en_US
dc.subjectInternational Conference on X-Rays & Related Techniques in Research & Industry (ICXRI)en_US
dc.titleGrowth of Cu-Zn5 and Cu5Zn8 intermetallic compounds in the Sn-9Zn/Cu joint during liquid state agingen_US
dc.typeWorking Paperen_US
dc.publisher.departmentSchool of Materials Engineering & School of Environmental Engineeringen_US
dc.contributor.urlramani@perlis.uitm.edu.myen_US
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