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dc.contributor.authorNazri, Md Daud-
dc.contributor.authorMazlan, Abdul Wahid-
dc.contributor.authorShafizal, Mat-
dc.date.accessioned2010-08-12T08:39:33Z-
dc.date.available2010-08-12T08:39:33Z-
dc.date.issued2009-06-20-
dc.identifier.urihttp://dspace.unimap.edu.my/123456789/8632-
dc.descriptionMUCEET 2009 is organized by Malaysian Technical Universities Network (MTUN) comprising of Universiti Malaysia Perlis (UniMAP), Universiti Tun Hussein Onn (UTHM), Universiti Teknikal Melaka (UTeM) and Universiti Malaysia Pahang (UMP), 20th - 22nd June 2009 at M. S. Garden Hotel, Kuantan, Pahang.en_US
dc.description.abstractThe purpose of this study is to determine the physical properties of the thermoelectric module. In order to do that a test rig has been fabricated and thermoelectric module model CP1.4-127-045L is tested. The voltage generated by the thermoelectric module and the temperature differences are measured and then by using some equations, physical properties such as Seebeck coefficient a, Electrical resistance R and Thermal conductivity Kt are obtained. These experiments data are then compared with the manufacturer data. From the experiment that has been done, the Seebeck coefficient for thermoelectric module model CP1.4-127-045L is 0.056 V/oC, thermal conductivity is 0.45 W°C-1 and electrical resistance is 1.67 W. Besides that the performance of thermoelectric module is also tested by using water cooling jacket and fin as a heat sink. For water cooling jacket, thermoelectric module that using flow rate at 6.62 cm3/s has the higher COP compared to flow rate at 2.32 cm3/s. While for TE module that contact with fin which contact ratio is 8.94 has a better COP compared to contact ratio of 6.88.en_US
dc.language.isoenen_US
dc.publisherUniversiti Malaysia Pahang (UMP)en_US
dc.relation.ispartofseriesProceedings of the Malaysian Technical Universities Conference on Engineering and Technology (MUCEET) 2009en_US
dc.subjectPhysical propertiesen_US
dc.subjectTemperature differencesen_US
dc.subjectThermoelectric moduleen_US
dc.subjectContact ratioen_US
dc.subjectMalaysian Technical Universities Conference on Engineering and Technology (MUCEET)en_US
dc.titleStudy on the physical properties and performance of thermoelectric moduleen_US
dc.typeWorking Paperen_US
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