Development of Sn-0.7Cu lead free solder alloy influence by Bismuth additions

Abstract

This study is based on Intermetallic Compound (IMC) analysis. Therefore, the scope for this project includes a review of the existing lead-free solder alloy material focusing on type of processing has been made, testing and result. Sample undergo the characterization analysis using microstructure analysis to find the intermetallic and eutectic point by using Scanning Electron Microscope (SEM) and Optical Microscope (OM). Hardness test is determined by using the Vickers test method, phase identification is identified using X-Ray Diffraction (XRD) and thermal analysis is to find the melting temperature is determined by Differential Scanning Calorimetry (DSC).