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Institute of Nano Electronic Engineering (INEE) (Articles)
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Results 1-6 of 6 (Search time: 1.18 seconds).
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Issue Date
Title
Author(s)
Jun-2013
Extended reliability of gold and copper ball bonds in microelectronic packaging
Chong, Leong Gan
;
Classe, Francis
;
Bak, Lee Chan
;
Uda, Hashim, Prof. Dr.
;
chong-leong.gan@spansion.com
;
uda@unimap.edu.my
2013
Reliability assessment and activation energy study of au and pd-coated cu wires post high temperature aging in nanoscale semiconductor packaging
Chong, Leong Gan
;
Uda, Hashim, Prof. Dr.
;
chong-leong.gan@spansion.com
;
clgan_pgg@yahoo.com
;
uda@unimap.edu.my
2013
Superior performance and reliability of copper wire ball bonding in laminate substrate based ball grid array
Chong, Leong Gan
;
Classe, Francis
;
Uda, Hashim, Prof. Dr.
;
uda@unimap.edu.my
;
chong-leong.gan@spansion.com
2013
Wearout reliability and intermetallic compound diffusion kinetics of Au and PdCu wires used in nanoscale device packaging
Chong, Leong Gan
;
E., K. Ng
;
Bak, Lee Chan
;
Classe, Francis
;
Kwuanjai, T.
;
Uda, Hashim, Prof. Dr.
;
clgan_pgg@yahoo.com
;
mflim@yahoo.com
;
gchongleong@gmail.com
;
chong-leong.gan@spansion.com
;
uda@unimap.edu.my
Aug-2013
Reliability assessment and mechanical characterization of Cu and Au ball bonds in BGA package
Chong, Leong Gan
;
Uda
;
chong-leong.gan@spansion.com
;
clgan_pgg@yahoo.com
;
uda@unimap.edu.my
Oct-2014
Influence of shear strength on long term biased humidity reliability of Cu ball bonds
Chong, Leong Gan
;
Uda, Hashim, Prof. Dr.
;
clgan_pgg@yahoo.com
;
uda@unimap.edu.my
Discover
Author
5
Uda, Hashim, Prof. Dr.
3
Classe, Francis
2
Bak, Lee Chan
1
E., K. Ng
1
Kwuanjai, T.
.
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Subject
2
High temperature storage life
2
Lognormal plot
1
Apparent activation energy
1
Apparent activation energy (Eaa)
1
Arrhenius plot
.
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Date issued
1
2014
5
2013