Please use this identifier to cite or link to this item: http://dspace.unimap.edu.my:80/xmlui/handle/123456789/79491
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DC FieldValueLanguage
dc.contributor.authorUniversiti Malaysia Perlis (UniMAP)-
dc.date2023-10-
dc.date.accessioned2023-10-10T02:14:48Z-
dc.date.available2023-10-10T02:14:48Z-
dc.date.issued2023-05-
dc.identifier.citation9 p.en_US
dc.identifier.urihttp://dspace.unimap.edu.my:80/xmlui/handle/123456789/79491-
dc.descriptionAccess is limited to UniMAP community.en_US
dc.language.isoenen_US
dc.publisherUniversiti Malaysia Perlis (UniMAP)en_US
dc.relation.ispartofseriesNDJ 21103;Semester 2 2022/2023-
dc.subject.otherExamination paperen_US
dc.subject.otherNDJ21103 -- Examination paperen_US
dc.subject.otherElectronic packaging -- Examination paperen_US
dc.subject.otherPembungkusan elektronik -- Examination paperen_US
dc.titleElectronic Packagingen_US
dc.title.alternativePembungkusan Elektroniken_US
dc.typeLearning Objecten_US
Appears in Collections:Past Year Exam Papers

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