Numerical analysis of GNP/Ag Die-Attach adhesives with different thermal conductivity

Abstract

The thermal conductivities of a multilayer model of GNP/Ag hybrid die-attach material are explored using steady-state thermal modeling. The heat flux in multilayer GNP/Ag hybrid structures is shown to be highly layer number dependent. It rises when thermal conductivity increases while density and specific heat value remain constant. For FEA analysis, six different thermal conductivity of GNP/Ag hybrid die-attach materials models were developed to compare with baseline findings from another researcher. By evaluating the total heat flux, FEA modeling was utilized to identify how the increase of thermal conductivity had affected the die-attach materials model. Fourier’s law of heat conduction was implemented to investigate thermal characteristics during heating with commercial software code, namely ANSYS. Temperature dependency and thermal material properties, and other thermal parameters boundary conditions were taken into consideration throughout the thermal conductivity procedure. The total heat flux distribution changes of dies with die-attach and substrate assemblies were obtained and thermal characteristics were analyzed during heating within 1 second by using temperature load, 90.3 ° C on the dies (diode) surface. Moreover, heat flow and material resistance were also manually calculated in the model by comparing the relationship discovered in the die-attach materials. GNP/Ag hybrid with the highest thermal conductivity, 300 W/m.K, offered the highest heat flux value in terms of simulation, 7.081 x 106 W/m2, and calculated, 24.695 x 106 W/m2. As a result, material resistance and heat flux were inversely proportional, and as material resistance reduced, so did heat flux or heat conduction on the material. Thermal conductivity values discovered on die-attach materials can also be utilized to demonstrate the similarities between thermal and material resistance.