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dc.contributor.authorMohd Khairuddin, Md Arshad-
dc.contributor.authorLim, Moy Fung-
dc.contributor.authorUda, Hashim-
dc.contributor.authorZaliman, Sauli-
dc.date.accessioned2010-01-03T06:36:10Z-
dc.date.available2010-01-03T06:36:10Z-
dc.date.issued2009-03-17-
dc.identifier.citationp.633-640en_US
dc.identifier.urihttp://www.electrochem.org/-
dc.identifier.urihttp://dspace.unimap.edu.my/123456789/7463-
dc.descriptionLink to publisher's homepage at http://www.electrochem.org/en_US
dc.description.abstractThis paper presents the study of the thermal aging of the gold ball bonds and aluminum bond pad at 150 °C and 200 °C for various interval times. Process decapsulation and Field Emission Scanning Electron Microscopy (FESEM) are used to reveal the intermetallic coverage and Kirkendall voiding. Energy Dispersive X-Ray (EDX) is then used to determine the intermetallic phase. The results shows that under thermal aging, the Kirkendall voids are seen, various intermetallic phases are detected and the intermetallic thickness increased tremendously at 200° C after 168 hrs as compared to 150 °C exposure times.en_US
dc.language.isoenen_US
dc.publisherThe Electrochemical Societyen_US
dc.relation.ispartofseriesProceedings of the 7th International Conference on Semiconductor Technology (ISTC 2008)en_US
dc.subjectIntermetallic growthen_US
dc.subjectThermal agingen_US
dc.subjectWire bondingen_US
dc.subjectField emissionen_US
dc.subjectSemiconductor materialsen_US
dc.subjectAluminumen_US
dc.subjectLight metalsen_US
dc.titleThermal aging study at 150 °C and 200 °C: Gold ball bonds to aluminum bond paden_US
dc.typeArticleen_US
Appears in Collections:Conference Papers
Uda Hashim, Prof. Ts. Dr.

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