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Please use this identifier to cite or link to this item: http://dspace.unimap.edu.my:80/xmlui/handle/123456789/74584
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dc.contributor.authorMohd Arif Anuar, Mohd Salleh-
dc.contributor.authorSandu, I G-
dc.contributor.authorMohd Mustafa Al Bakri, Abdullah-
dc.contributor.authorSandu, I-
dc.date2022-
dc.date.accessioned2022-03-07T06:42:46Z-
dc.date.available2022-03-07T06:42:46Z-
dc.date.issued2017-06-
dc.identifier.citationIOP Conference Services: Material Sciences Engineering, vol.209, 2017, 7 pagesen_US
dc.identifier.urihttp://dspace.unimap.edu.my:80/xmlui/handle/123456789/74584-
dc.descriptionLink to publisher's homepage at https://iopscience.iop.org/en_US
dc.description.abstractIn this digital-age era, solder plays important role in electronic packaging industries. As interconnects material, solder provide an electrical and mechanical support to the electronics devices. Solder usually consist of two or more addition of microalloying. By microalloying addition, the solidification structure can be modified. This paper reviews the addition of Ni as microalloying in Sn-Cu lead free solder. Small additions of Ni resulted with an improvement of solder in microstructure and in intermetallic compounds. The stabilization of hexagonal structure of Cu6Sn5 in lead-free solder alloys occurred due to present of Nien_US
dc.language.isoenen_US
dc.publisherIOP Publishing Ltden_US
dc.relation.ispartofseriesInternational Conference on Innovative Research (ICIR Euroinvent 2017);-
dc.subject.otherNikel (Ni)en_US
dc.subject.otherSolderen_US
dc.titleNickel (Ni) microalloying additions in Sn-Cu lead-free solder. short reviewen_US
dc.typeArticleen_US
dc.identifier.doihttps://doi.org/10.1088/1757-899x/209/1/012084-
dc.contributor.urlarifanuar@unimap.edu.myen_US
Appears in Collections:Mohd Arif Anuar Mohd Salleh, Associate Professor Dr. Ir.
Mohd Mustafa Al Bakri Abdullah, Prof. Dr.

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