Please use this identifier to cite or link to this item: http://dspace.unimap.edu.my:80/xmlui/handle/123456789/69246
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dc.contributor.authorNurehansafwanah, Khalid-
dc.contributor.authorSiti Zuraidah, Ibrahim-
dc.contributor.authorFwen Hoon, Wee-
dc.date.accessioned2021-01-06T00:50:29Z-
dc.date.available2021-01-06T00:50:29Z-
dc.date.issued2017-
dc.identifier.citationMATEC Web of Conferences, vol.140, 2017, 4 pagesen_US
dc.identifier.issn2261-236X (online)-
dc.identifier.urihttp://dspace.unimap.edu.my:80/xmlui/handle/123456789/69246-
dc.descriptionLink to publisher's homepage at https://www.matec-conferences.org/en_US
dc.description.abstractThis paper shows designed coupler on paper-substrate with Substrate Integrated Waveguide (SIW) techniques. Types of paper-substrate that used are photographic paper. The rectangular coupler is presented with Substrate Integrated Waveguide (SIW) which metallic via on paper-substrate. The structures of the coupler are designed and analysed using Computer Simulation Tools (CST) Studio Suite 2014 Software. This designed coupler operating within frequency of 3.8-5 GHz. The paper-based substrates are permits the implementation of green materials (Eco-friendly) technology. The design of the coupler and its simulated results are reported in this paper.en_US
dc.language.isoenen_US
dc.publisherEDP Sciencesen_US
dc.relation.ispartofseries2017 International Conference on Emerging Electronic Solutions for IoT (ICEESI 2017);-
dc.subjectSubstrate Integrated Waveguide (SIW)en_US
dc.titleSubstrate Integrated Waveguide (SIW) Coupler on Green Material Substrate for Internet of Things (IoT) Applicationsen_US
dc.typeArticleen_US
dc.identifier.doihttps://doi.org/10.1051/matecconf/201714001022-
dc.contributor.urlnurehansafwanah@yahoo.comen_US
Appears in Collections:School of Computer and Communication Engineering (Articles)
Wee Fwen Hoon, Assoc. Prof. Dr.



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