Please use this identifier to cite or link to this item: http://dspace.unimap.edu.my:80/xmlui/handle/123456789/68833
Title: Nanoindentation of graphene reinforced epoxy resin as a conductive ink for microelectronic packaging application
Authors: Maizura, Mokhlis
Mohd Azli, Salim
Nor Azmmi, Masripan
Adzni, Md. Saad
Mohd Nizam, Sudin
Ghazali, Omar
Caridi, Francesco
azli@utem.edu.my
Keywords: Graphene nanoplatelets
Nanoindentation
Hardness
Young’s Modulus
Conductive Ink
Issue Date: May-2020
Publisher: Universiti Malaysia Perlis (UniMAP)
Citation: International Journal of Nanoelectronics and Materials, vol.13(Special Issue), 2020, pages 407-418
Series/Report no.: International Symposium on Science, Technology and Engineering (ISSTE 2019);
Abstract: Conductive ink is a special type of ink which allows current to flow through the ink. There are several varieties of conductive inks in the market and it is crucial to choose a suitable ink for the electronic applications. Graphene material is chosen to replace the current ink due to its promising properties that have been explored by many researchers. This paper aims to investigate the effect of temperature and percentage of graphene ink on hardness and Young's modulus of printed graphene ink samples. Samples were fabricated using a simple method involving formulating, mixing, printing and curing processes and the ink was printed on the glass slide substrate. The samples were cured at 160°C and 180°C for one hour. The mechanical properties of printed graphene ink sample were evaluated using Dynamic Ultra Micro Hardness (DUMH). All the measurements were done with the same force of indentation to avoid the possibility of perforation of printed graphene ink. The results show that higher curing temperature and percentage of filler loading give bigger Young’s modulus and hardness of the printed graphene ink sample
Description: Link to publisher's homepage at http://ijneam.unimap.edu.my
URI: http://dspace.unimap.edu.my:80/xmlui/handle/123456789/68833
ISSN: 1985-5761 (Printed)
1997-4434 (Online)
Appears in Collections:International Journal of Nanoelectronics and Materials (IJNeaM)

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