Please use this identifier to cite or link to this item:
http://dspace.unimap.edu.my:80/xmlui/handle/123456789/68727
Title: | Influence of Material Properties on the Fluid-Structure Interaction aspects during Molded Underfill Process |
Authors: | Chu Yee, Khor Muhammad Ikman, Ishak M.U., Rosli Mohd Riduan, Jamalludin M.S., Zakaria A.F.M., Yamin M.S., Abdul Aziz M.Z., Abdullah cykhor@unimap.edu.my |
Keywords: | Epoxy moulding compound (EMC) Moulded underfill process (MUF) Finite volume (FV) |
Issue Date: | Feb-2017 |
Publisher: | EDP Sciences |
Citation: | MATEC Web Conferences, vol.97, 2017, 6 pages |
Series/Report no.: | Engineering Technology International Conference 2016 (ETIC 2016); |
Abstract: | This paper presents the investigation of the effects of epoxy moulding compound’ (EMC) viscosity on the FSI aspects during moulded underfill process (MUF). Finite volume (FV) code and finite element (FE) code were connected online through the Mesh-based Parallel Code Coupling Interface (MpCCI) method for fluid and structural analysis. The EMC flow behaviour was modelled by Castro-Macosko model, which was written in C language and incorporated into the FV analysis. Real-time predictions on the flow front, chip deformation and stress concentration were solved by FV- and FE-solver. Increase in EMC viscosity raises the deformation and stress imposed on IC and solder bump, which may induce unintended features on the IC structure. The current simulation is expected to provide the better understandings and clear visualization of FSI in the moulded underfill process. |
Description: | Link to publisher's homepage at https://www.matec-conferences.org/ |
URI: | http://dspace.unimap.edu.my:80/xmlui/handle/123456789/68727 |
ISSN: | 2261-236X (online) |
Appears in Collections: | Faculty of Engineering Technology (Articles) |
Files in This Item:
File | Description | Size | Format | |
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Influence of Material Properties on the Fluid-Structure.pdf | Main article | 420.91 kB | Adobe PDF | View/Open |
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