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Full metadata record
DC Field | Value | Language |
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dc.contributor.author | Mohd Izrul Izwan, Ramli | - |
dc.contributor.author | Mohd Arif Anuar, Mohd Salleh | - |
dc.contributor.author | H., Yasuda | - |
dc.contributor.author | J., Chaiprapa | - |
dc.contributor.author | K., Nogita | - |
dc.date.accessioned | 2020-11-13T03:44:05Z | - |
dc.date.available | 2020-11-13T03:44:05Z | - |
dc.date.issued | 2019-10 | - |
dc.identifier.citation | Materials & Design, vol.186, 2020, 16 pages | en_US |
dc.identifier.issn | 0264-1275 (print) | - |
dc.identifier.issn | 1873-4197 (online) | - |
dc.identifier.uri | http://dspace.unimap.edu.my:80/xmlui/handle/123456789/68724 | - |
dc.description | Link to publisher's homepage at https://www.sciencedirect.com/ | en_US |
dc.description.abstract | This paper elucidated the effects of the Bi element (0 wt%, 0.5 wt% and 1.5 wt%) on the microstructure, electrical, wettability and mechanical properties of the Sn-0.7Cu-0.05Ni as a high strength solder. Besides using the conventional cross-sectioned microstructure image, the real-time synchrotron radiation imaging and synchrotron micro-X-ray fluorescence (XRF) technique was also used to investigate the microstructure, focusing on the in-situ growth behaviour of the primary (Cu,Ni)6Sn5 intermetallic and elemental distribution that had occurred in the Sn-0.7Cu-0.05Ni-1.5Bi. Other essential properties of solder material, such as wettability, electrical resistance, and shear strength, were also determined. The results showed that the addition of 1.5 wt% Bi refined the primary (Cu,Ni)6Sn5 intermetallics formation in the solder joint, where it grew earlier and faster relative to that in the Sn-0.7Cu-0.05Ni/Cu joint. Additionally, the addition of 1.5 wt% Bi resulted with a 3% reduction of its electrical resistance while increasing the wettability of the solder alloy. 1.5 wt% addition of the Bi element also found to have contributed to a significant increment of shear strength relative to that of the Sn-0.7Cu-0.05Ni. The results confirmed that the developed material is applicable as a potential high strength solder material in the context of advanced interconnecting applications. | en_US |
dc.language.iso | en | en_US |
dc.publisher | Elsevier | en_US |
dc.subject | Soldering | en_US |
dc.subject | Solder | en_US |
dc.subject | Interconnects | en_US |
dc.subject | Intermetallics | en_US |
dc.subject | Solid solution | en_US |
dc.subject | Microstructure | en_US |
dc.subject | Solder properties | en_US |
dc.title | The effect of Bi on the microstructure, electrical, wettability and mechanical properties of Sn-0.7Cu-0.05Ni alloys for high strength soldering | en_US |
dc.type | Article | en_US |
dc.identifier.doi | https://doi.org/10.1016/j.matdes.2019.108281 | - |
dc.contributor.url | mohdizrulizwan@gmail.com | en_US |
dc.contributor.url | arifanuar@unimap.edu.my | en_US |
dc.contributor.url | yasuda.hideyuki.6s@kyoto-u.ac.jp | en_US |
dc.contributor.url | jitrin@slri.or.th | en_US |
dc.contributor.url | k.nogita@uq.edu.au | en_US |
Appears in Collections: | Mohd Arif Anuar Mohd Salleh, Associate Professor Dr. Ir. |
Files in This Item:
File | Description | Size | Format | |
---|---|---|---|---|
Effect of Solids-To-Liquids, Na2SiO3-To-NaOH.pdf | 1.62 MB | Adobe PDF | View/Open | |
The effect of Bi on the microstructure, electrical, wettability.pdf | Main article | 4.37 MB | Adobe PDF | View/Open |
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