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dc.contributor.authorMohd Khairuddin, Md Arshad-
dc.contributor.authorIbrahim, Ahmad-
dc.contributor.authorAzman, Jalar-
dc.contributor.authorUda, Hashim-
dc.date.accessioned2009-07-07T04:38:21Z-
dc.date.available2009-07-07T04:38:21Z-
dc.date.issued2005-12-06-
dc.identifier.urihttp://dspace.unimap.edu.my/123456789/6339-
dc.descriptionOrganized by Universiti Putra Malaysia (UPM), 6th - 8th December 2005 at Putra World Trade Centre (PWTC), Kuala Lumpur.en_US
dc.description.abstractThe low cost deposition of under bump metallurgy (UBM) method presented in this paper is based on electroless nickel immersion gold (ENIG) bumping process. The study is focuses on the effect of temperature, pH and exposure time to the deposition of nickel thickness. Metallurgical cross-section and image capturing system were used as analytical tools. Result suggests that with the increase of temperature, pH and exposure time, the nickel thickness also increased.en_US
dc.language.isoenen_US
dc.publisherUniversiti Putra Malaysia (UPM)en_US
dc.relation.ispartofseriesInternational Advanced Technology Congressen_US
dc.subjectUnder bump metallurgy (UBM)en_US
dc.subjectWafer bumpingen_US
dc.subjectElectroless nickel immersion gold (ENIG)en_US
dc.subjectSurface roughnessen_US
dc.subjectElectroless depositionen_US
dc.subjectNickel-platingen_US
dc.titleThe effect of temperature, pH and exposure time to Electroless Nickel Deposition for Under Bump Metallurgy (UBM)en_US
dc.typeWorking Paperen_US
Appears in Collections:Conference Papers
Uda Hashim, Prof. Ts. Dr.

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