Aging effect of Sn-Ag-Cu lead free solder

Abstract

Many issue related to the performance of lead free solder alloys have arisen. So, it should be take concern on it and one of the method is by studying the microstructure of those solder alloys. This because their mechanical properties also depend on the microstructure and also the stability of the microstructure. A comprehensive understanding of the process microstructure property relationships is essential. Toward that goal, lead free solder alloy candidates such Sn-3.0Ag-0.5C was studied in their microstructure because a comprehensive understanding of the microstructure is still lacking. Ternary alloy such Sn-3.0Ag-0.5Cu is one of the most promising lead free solder alloy for reflow soldering. A microstructure analysis is performed by using digital microscopy. A detailed microstructure characterization with respect to phase compositions has been done by using SEM-EDX. From these study, the influence of alloying element such Cu will effect in microstructure and its mechanical properties. The network microstructure of Sn-3.0Ag-0.5Cu consist of CuSn5 and AgSn in the matrix of the ß-Sn. The melting temperature range of this solder only can be as reference for selection of solder for its application.