Please use this identifier to cite or link to this item: http://dspace.unimap.edu.my:80/xmlui/handle/123456789/48339
Title: The use of jackruit peel as filler in polylactic acid biocomposite films: effect of filler modification
Authors: Santhi Dewi, Perumal
Dr. Mohamad Syahmie Mohamad Rasidi
Keywords: Biocomposite films
Composites
Jackfruit peel filler (JPF)
Poly(lactic acid) (PLA)
Filler
Polymer biocomposites
Issue Date: Jun-2016
Publisher: Universiti Malaysia Perlis (UniMAP)
Abstract: The biocomposite films of jackfruit peel filler (JPF) and poly(lactic acid) (PLA) were prepared by solution casting method. The effect of jackfruit peel filler (JPF) content and modification of JPF by silane coupling agent on tensile and thermal properties, morphology and biodegradation of PLA/JPF biocomposite films were studied. The result obtained showed that the tensile strength and elongation at break decreased as JPF content in biocomposite films increased. Meanwhile, Young’s modulus increased with increasing JPF content. The SEM micrographs showed poor filler-matrix interaction between JPF and PLA matrix. The improved thermal stability was observed at higher JPF content as the total weight loss of biocomposite films was lower. The weight loss of biocomposite films in enzymatic biodegradation increased with increasing JPF content. The modification of JPF by silane coupling agent results in improved tensile strength and Young’s modulus but reduced elongation a break of modified biocomposite films. The morphological studies proved that modified JPF has better dispersion in PLA matrix. The modified biocomposite films have better thermal stability as shown by the lower weight loss at temperature at higher degradation temperature. The changes of functional group of unmodified and modified biocomposite films were proven by the FTIR study. The enzymatic biodegradation of modified biocomposite films showed lower weight loss compared to unmodified biocomposite films.
Description: Access is limited to UniMAP community.
URI: http://dspace.unimap.edu.my:80/xmlui/handle/123456789/48339
Appears in Collections:School of Materials Engineering (FYP)

Files in This Item:
File Description SizeFormat 
Abstract,Acknowledgement.pdf283.49 kBAdobe PDFView/Open
Introduction.pdf259.76 kBAdobe PDFView/Open
Literature Review.pdf600.05 kBAdobe PDFView/Open
Methodology.pdf380.01 kBAdobe PDFView/Open
Results and Discussion.pdf1.03 MBAdobe PDFView/Open
Conclusion and Recommendation.pdf255.47 kBAdobe PDFView/Open
Refference and Appendics.pdf390.17 kBAdobe PDFView/Open


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