Please use this identifier to cite or link to this item: http://dspace.unimap.edu.my:80/xmlui/handle/123456789/48096
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dc.contributor.authorHazimah, Rasid-
dc.date.accessioned2017-05-16T04:45:06Z-
dc.date.available2017-05-16T04:45:06Z-
dc.date.issued2016-05-
dc.identifier.urihttp://dspace.unimap.edu.my:80/xmlui/handle/123456789/48096-
dc.descriptionAccess is limited to UniMAP community.en_US
dc.description.abstractThe research in this study involves production and characterization of epoxy syntactic foam with hollow spheres (EHoS) by using simple casting technique and innovation process. The epoxy syntactic foam (ESF) comprises single coated and double coated EHoS/ESF. Two different diameter of cell sizes EHoS also used which are small size (1-3mm) and medium size (4-6mm). EHoS is produced by coating the EPS beads with epoxy resin to save the cost whereas ESF is produced by embedding EHoS into mixture epoxy – hardener with 3% KOH solution. It was observed that the density, compression strength and modulus is higher for double coating (DC) of EHoS compared to single coated (SC) because of thicker wall cell. However, for the mode of failure EHoS SC is crushing and collapse completely and EHoS DC exhibits shear cracking matrix during compression loading. However, for flatwise orientation demonstrates higher compression strength and modulus than edgewise orientation due to the sample dimension has smaller aspect ratio so lateral expansion is restricted. Lastly, ESF filled with small sizes of EHoS give higher compression strength and modulus compared to ESF filled with medium size of EHoS.en_US
dc.language.isoenen_US
dc.publisherUniversiti Malaysia Perlis (UniMAP)en_US
dc.subjectEpoxy syntactic foamen_US
dc.subjectEpoxy syntactic foam with hollow spheres (EHoS)en_US
dc.subjectHollow Spheres filleren_US
dc.subjectHollow Spheresen_US
dc.subjectFilleren_US
dc.titleProduction and charaterization of epoxy syntactic foam filled hollow spheresen_US
dc.typeLearning Objecten_US
dc.contributor.advisorSiti Salmi Samsudinen_US
dc.publisher.departmentSchool of Microelectronic Engineeringen_US
Appears in Collections:School of Microelectronic Engineering (FYP)

Files in This Item:
File Description SizeFormat 
Abstract,Acknowledgement.pdf210.62 kBAdobe PDFView/Open
Introduction.pdf163.72 kBAdobe PDFView/Open
Literature Review.pdf303.26 kBAdobe PDFView/Open
Methodology.pdf324.49 kBAdobe PDFView/Open
Results and Discussion.pdf605.7 kBAdobe PDFView/Open
Conclusion and Recommendation.pdf156.98 kBAdobe PDFView/Open
Refference and Appendics.pdf136.29 kBAdobe PDFView/Open


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