Please use this identifier to cite or link to this item:
http://dspace.unimap.edu.my:80/xmlui/handle/123456789/48080
Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Chew, Jun Yuen | - |
dc.date.accessioned | 2017-05-16T02:05:17Z | - |
dc.date.available | 2017-05-16T02:05:17Z | - |
dc.date.issued | 2016-06 | - |
dc.identifier.uri | http://dspace.unimap.edu.my:80/xmlui/handle/123456789/48080 | - |
dc.description | Access is limited ti UniMAP community. | en_US |
dc.description.abstract | Nanostructured cuprous oxide were grown by the process of anodization of copper plate in the electrolyte of ethylene glycol mixed 0.15M KOH + 0.1M NH4F + 3% H₂O for 300 second under varying the conditions including anodizing voltage and temperature of electrolyte. The characteristic of the anodized copper plates were confirmed by X-ray diffraction (XRD), Field emission scanning electron microscopy (FESEM), Fourier transform infrared (FTIR), UV-Visible spectroscopy (UV-Vis) and photoluminescence spectroscopy (PL). The cuprous oxide nanoparticle aggregates morphologies were formed in both parameters. Increasing in the temperature will cause to increase the grain size of the cuprous oxide nanoparticles aggregates while increasing in the anodizing voltage will lead to increase the growth rate and dissolution rate. The as-prepared cuprous oxide layer on the copper surface had confirmed by XRD and FTIR and it showed a relatively low band gap after characterized by PL. | en_US |
dc.language.iso | en | en_US |
dc.publisher | Universiti Malaysia Perlis (UniMAP) | en_US |
dc.subject | Nanostructured | en_US |
dc.subject | Anodizing | en_US |
dc.subject | Copper | en_US |
dc.subject | Oxide | en_US |
dc.subject | Voltage | en_US |
dc.title | Effect of temperature of electrolyte and anodizing voltage on the synthesis of CU₂O nanostructures by anodizing | en_US |
dc.type | Learning Object | en_US |
dc.contributor.advisor | Dr. Voon Chun Hong | en_US |
dc.publisher.department | School of Materials Engineering | en_US |
Appears in Collections: | School of Materials Engineering (FYP) |
Files in This Item:
File | Description | Size | Format | |
---|---|---|---|---|
Acknowledgement.pdf | 345.91 kB | Adobe PDF | View/Open | |
Introduction.pdf | 303.66 kB | Adobe PDF | View/Open | |
Literature Review.pdf | 2.33 MB | Adobe PDF | View/Open | |
Methodology.pdf | 540.67 kB | Adobe PDF | View/Open | |
Results and Discussion.pdf | 1.34 MB | Adobe PDF | View/Open | |
Conclusion and Recommendation.pdf | 195.1 kB | Adobe PDF | View/Open | |
Refference and Appendics.pdf | 315.42 kB | Adobe PDF | View/Open |
Items in UniMAP Library Digital Repository are protected by copyright, with all rights reserved, unless otherwise indicated.