Please use this identifier to cite or link to this item: http://dspace.unimap.edu.my:80/xmlui/handle/123456789/40982
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dc.contributor.authorLim Yee, Chew-
dc.date.accessioned2016-03-07T01:49:54Z-
dc.date.available2016-03-07T01:49:54Z-
dc.date.issued2010-04-
dc.identifier.urihttp://dspace.unimap.edu.my:80/xmlui/handle/123456789/40982-
dc.descriptionAccess is limited to UniMAP community.en_US
dc.description.abstractThis study concerns the Test Probes a semiconductor manufacturing process improvement. It is learned through the process flow and by collecting the required process time of the production line, then determined the causes and effects of running long production cycle times which widely vary and the cumulative impact on operating results are nearly incalculable. Identifying and correcting the root cause impediments are needed to be done in order to achieve significant improvements in production performance. So that the non-value added activities or time should be found by using the Lean Elements. Therefore, a lean technique, 5 S is used to reduce the processes cycle-time and increase the productivity in production line. 5 S is a combination of 5 items which are Sort, Sort in order, Shine, Standardizing and Self-discipline.en_US
dc.language.isoenen_US
dc.publisherUniversiti Malaysia Perlis (UniMAP)en_US
dc.subjectCycle timeen_US
dc.subjectSemiconductor -- Manufacturing processen_US
dc.subjectProduction cycle timeen_US
dc.subjectCycle time improvementen_US
dc.titleReducing cycle time in semiconductor manufacturing processen_US
dc.typeLearning Objecten_US
dc.contributor.advisorDr Muhammad Iqbal Muhammad Hussainen_US
dc.publisher.departmentSchool of Manufacturing Engineeringen_US
Appears in Collections:School of Manufacturing Engineering (FYP)

Files in This Item:
File Description SizeFormat 
Abstract,Acknowledgement.pdf224.15 kBAdobe PDFView/Open
Introduction.pdf381.12 kBAdobe PDFView/Open
Literature Review.pdf226.73 kBAdobe PDFView/Open
Methodology.pdf131.29 kBAdobe PDFView/Open
Results and Discussion.pdf330.77 kBAdobe PDFView/Open
Conclusion and Recommendation.pdf68.14 kBAdobe PDFView/Open
Reference and Appendix.pdf204.21 kBAdobe PDFView/Open


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